The electronics manufacturing world has long desired a low heat processing solution. Advanced electronics designs with lightweight flexible substrates and sensitive miniaturized components require a dramatic reduction in processing heat while still maintaining high operating temperature requirements. SAFi-Tech’s patented platform allows SAC305, the industry standard high temperature alloy, to be processed at temperatures as low as ambient opening the door to the future of electronics.
Revolutionizing Design
Thinner - Lighter - Flexible
Removing heat from electronics manufacturing redefines design capabilities by enhancing miniaturization, enabling the use of desirable substrates, and achieving the highest resolution prints.
Eliminating Cost
Energy - Environment
Reducing time required in reflow ovens delivers significant energy savings while also reducing carbon emissions.
Throughput - Footprint
Reducing time required in reflow ovens increases volume throughput and reduces required size of reflow oven
Materials - Yields
Reducing exposure to high temperatures allows for the use of lower cost materials and eliminates thermal fouling
